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Description
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all your bonding procedures. Bond-1 Primer/Adhesive has been proven to create the ideal sealed surface and interpenetrated network of the polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm.